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? 2012 microchip technology inc. ds52056a mcp2210 breakout module user?s guide
ds52056a-page 2 ? 2012 microchip technology inc. information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mxdev, mxlab, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, app lication maestro, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, total endurance, tsharc, uniwindriver, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-62076-117-5 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specifications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer c an guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvi ng the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management system certified by dnv == iso/ts 16949 ==
mcp2210 breakout module user?s guide ? 2012 microchip technology inc. ds52056a-page 3 table of contents preface ....................................................................................................................... .... 5 introduction............................................................................................................ 5 document layout .................................................................................................. 5 conventions used in this guide ............................................................................ 6 recommended reading........................................................................................ 7 the microchip web site ........................................................................................ 7 customer support ................................................................................................. 7 document revision history ................................................................................... 7 chapter 1. product overview 1.1 introduction ..................................................................................................... 9 1.2 mcp2210 breakout module general description .......................................... 9 1.3 what the mcp2210 breakout module kit includes ........................................ 9 chapter 2. installation and operation 2.1 introduction ................................................................................................... 11 2.2 board setup ................................................................................................. 11 2.3 board operation ........................................................................................... 12 2.4 mcp2210 typical usage scenarios ............................................................. 14 appendix a. schematic and layouts a.1 introduction .................................................................................................. 17 a.2 board ? schematic ....................................................................................... 18 a.3 board ? top silk and pads .......................................................................... 19 a.4 board ? top silk, pads and copper ............................................................ 20 a.5 board ? top pads and copper .................................................................... 21 a.6 board ? bottom silk and pads ..................................................................... 22 a.7 board ? bottom silk, pads and copper ....................................................... 23 a.8 board ? bottom pads and copper ............................................................... 24 appendix b. bill of materials worldwide sales and service .................................................................................... 26
mcp2210 breakout module user?s guide ds52056a-page 4 ? 2012 microchip technology inc.
mcp2210 breakout module user?s guide ? 2012 microchip technology inc. ds52056a-page 5 preface introduction this chapter contains general information that will be useful to know before using the mcp2210 breakout module. items discussed in this chapter include: ? document layout ? conventions used in this guide ? recommended reading ? the microchip web site ? customer support ? document revision history document layout this document describes how to use the mcp2210 breakout module board. the manual layout is as follows: ? chapter 1. ?product overview? ? important information about the mcp2210 breakout module ? chapter 2. ?installation and operation? ? covers the initial set-up of this board, required tools, board setup and graphical user interface (gui) ? appendix a. ?schematic and layouts? ? shows the schematic and board layouts for the mcp2210 breakout module user?s guide ? appendix b. ?bill of materials? ? lists the parts used to populate the mcp2210 breakout module notice to customers all documentation becomes dated, and this manual is no exception. microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. please refer to our web site (www.microchip.com) to obtain the latest documentation available. documents are identified with a ?ds? number. this number is located on the bottom of each page, in front of the page number. the numbering convention for the ds number is ?dsxxxxxa?, where ?xxxxx? is the document number and ?a? is the revision level of the document. for the most up-to-date information on development tools, see the mplab ? ide online help. select the help menu, and then topics to open a list of available online help files.
mcp2210 breakout module user?s guide ds52056a-page 6 ? 2012 microchip technology inc. conventions used in this guide this manual uses the following documentation conventions: documentation conventions description represents examples arial font: italic characters referenced books mplab ? ide user?s guide emphasized text ...is the only compiler... initial caps a window the output window a dialog the settings dialog a menu selection select enable programmer quotes a field name in a window or dialog ?save project before build? underlined, italic text with right angle bracket a menu path file>save bold characters a dialog button click ok a tab click the power tab n?rnnnn a number in verilog format, where n is the total number of digits, r is the radix and n is a digit. 4?b0010, 2?hf1 text in angle brackets < > a key on the keyboard press , courier new font: plain courier new sample source code #define start filenames autoexec.bat file paths c:\mcc18\h keywords _asm, _endasm, static command-line options -opa+, -opa- bit values 0, 1 constants 0xff, ?a? italic courier new a variable argument file .o , where file can be any valid filename square brackets [ ] optional arguments mcc18 [options] file [options] curly brackets and pipe character: { | } choice of mutually exclusive arguments; an or selection errorlevel {0|1} ellipses... replaces repeated text var_name [, var_name...] represents code supplied by user void main (void) { ... }
preface ? 2012 microchip technology inc. ds52056a-page 7 recommended reading this user's guide describes how to use mcp2210 breakout module. other useful documents are listed below. the following microchip document is available and recommended as a supplemental reference resource. ? mcp2210 data sheet - ?usb-to-spi protocol converter with gpio (master mode)? (ds22288) the microchip web site microchip provides online support via our web site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faqs), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://www.microchip.com/support . document revision history revision a (march 2012) ? initial release of this document.
mcp2210 breakout module user?s guide ds52056a-page 8 ? 2012 microchip technology inc. notes:
mcp2210 breakout module user?s guide ? 2012 microchip technology inc. ds52056a-page 9 chapter 1. product overview 1.1 introduction this chapter provides an overview of the mcp2210 breakout module and covers the following topics: ? mcp2210 breakout module general description ? what the mcp2210 breakout module kit includes 1.2 mcp2210 breakout module general description the mcp2210 breakout module is a development and evaluation platform for the mcp2210 device. the module is comprised of a single dip form-factor board. the mcp2210 breakout module has the following features: ? spi bus signals (mosi, miso, sck) ? nine gp lines, configurable for gpio, chip select or dedicated function operation ? provides a user selectable (by using a jumper) power supply of 3.3v or 5v (up to 500 ma) ? dip form-factor (0.6 inches overall row spacing between pins) ? pickit? serial analyzer header ? used for spi communication only a windows ? -based pc software was created to help with the evaluation/demonstration of the mcp2210 device as a usb-to-spi (master) device. it allows i/o control and custom device configuration. the software is downloadable from the board web page on www.microchip.com . a dll package is included to allow development of custom pc applications using the mcp2210. the dll package is also available for download on the board web page. 1.3 what the mcp2210 breako ut module kit includes the mcp2210 breakout module kit includes: ? mcp2210 breakout module (adm00419) ?mini-usb cable ? important information sheet
mcp2210 breakout module user?s guide ds52056a-page 10 ? 2012 microchip technology inc. notes:
mcp2210 breakout module user?s guide ? 2012 microchip technology inc. ds52056a-page 11 chapter 2. installa tion and operation 2.1 introduction the mcp2210 breakout module is designed to demonstrate the device as a usb-to-spi (master) bridge solution. the package is comprised of a single board and has the following features: ? small plug-in board with dip form factor (600 millimeters overall row spacing between pins) ? mini-usb connector ? access to spi bus and all gp signals through usb port ? pickit? serial analyzer compatible header ? 3.3 or 5v jumper selectable v dd ; the breakout board can be used to supply up to 500 ma to the rest of the system. the board already provides a signal trace between the v dd and the 3.3v rail. for systems requiring 5v v dd power supply, v dd header must be mounted on the board. a jumper will close the middle pin and the 5v pin. 2.2 board setup follow these steps to set up the mcp2210 breakout module: 1. download the support material (pc applications and dll libraries) that can be found on the board?s page, on the microchip web site. 2. attach the mcp2210 breakout module to a board that has one or more spi slave devices attached to a bus (spi). 3. plug the mcp2210 breakout module in to a pc. 4. the computer operating system will automatically install the driver for this board. when the installation is complete, the board is ready for operation. 5. install the downloaded pc software. 6. start the spi terminal utility.
mcp2210 breakout module user?s guide ds52056a-page 12 ? 2012 microchip technology inc. 2.3 board operation the mcp2210 will be detected by a windows pc host as an hid device. the accompanying software can be used to exercise the mcp2210 breakout module?s features and also provides a reference point for users that want to design their own applications based on the mcp2210 device. 2.3.1 mcp2210 breakout board operation the mcp2210 breakout module can be used as a stand-alone usb-to-spi (master) bridge module. the breakout board provides all the signals required to assist the user in building their boards with the mcp2210. the board has the following features: ? spi bus signals (mosi, miso, sck) ? nine gp signals that can be configured for: - gpio functionality (digital input or output pins) - chip select functionality (working with the spi bus signals) - dedicated function pins ? jumper selectable power supply: 3.3 or 5v (up to 500 ma) ? pickit? serial analyzer header using gp4 pin as chip select signal ? dip form-factor (0.6 inches overall row spacing between pins) by using the provided software and libraries, the user can create personalized pc applications, using the breakout board as a usb-to-spi (master) bridge adapter. 2.3.2 mcp2210 utility the mcp2210 utility software was created for custom device setting requirements. a few of the settings that this utility can alter include vid, pid, power requirements, and string descriptors. a download link for this software can be found on the board web page. for instructions on the use of this software, refer to the software?s supporting documentation included within the application install package. 2.3.3 spi terminal utility the spi terminal utility is a tool that allows low-level data exchange at the spi bus level. this application is useful for low-level communication and troubleshooting between the mcp2210 and various spi slave modules. the utility window has different sections for gp designation, spi transfer parameters and user data areas. note: this function is available only on spi operations, it does not work on i 2 c or uart signals.
installation and operation ? 2012 microchip technology inc. ds52056a-page 13 figure 2-1: spi term inal utility window after the application is started, the state of the connection with the mcp2210 is shown in the status messages section (lower left corner of the screen). the user can establish the gp configuration. the gps can be used as chip select pins. each gp active and idle value can be established by selecting the appropriate check boxes, or by directly supplying the correct value in the gp direct settings section. the same behavior applies to the gp designation (the gp designation can be established by clicking the appropriate radio button, or by directly supplying the gp designation value in the gp settings direct values section). the spi settings pertaining to the needed spi transfer can be established in the spi parameters section. the data to be sent goes in the tx data field. to send the data to the spi slave device, click the spi transfer data button on the lower-right side of the screen. the data received from the spi slave device is displayed in the rx data field. the user data can be supplied in either hex or decimal mode. this can be accom- plished by selecting the hex mode check box. the data in the tx and rx data fields will be displayed in hex or decimal. gp settings section transfer data button status messages spi transfer parameters section hex/decimal user data mode spi user data section gp direct settings section
mcp2210 breakout module user?s guide ds52056a-page 14 ? 2012 microchip technology inc. a wider range of tests is available when using this board and the utility software with the mcp2210 evaluation kit (adm00421). this kit allows communication with several spi slave devices (i/o expander, eeprom, adc and temperature sensor). for more details on examples using the spi terminal utility software, see mcp2210 evaluation kit user?s guide (ds52057). 2.4 mcp2210 typical usage scenarios mcp2210 can be used in systems where an spi bus is available. the mcp2210 can be either the single master on the bus, or one of the masters sharing the bus, if a proper master access arbitration scheme is in place. a typical usage scenario is shown in figure 2-2, where mcp2210 is the only master on the spi bus. this links the spi slave chips in the system, while a few gps (configured for chip select function) can be used as chip select lines. if spi slave interrupt monitoring is required, the gp6 needs to be configured for its dedicated function, in order to monitor the interrupts coming from the spi slave chips. the pc application will take care of all the details necessary for data transfer between the mcp2210 and the spi slave chips. figure 2-2: mcp2210 typical usage diagram when a system requires more than one spi master that share the same bus, an arbitration scheme needs to be developed, in order to prevent the multiple spi masters from accessing the bus at the same time. mcp2210 has support for an arbitration mechanism which uses gp7 and gp8 (configured for dedicated pin functionality) for this purpose. mcp2210 spi bus chip select lines mosi, miso, sck cs0-cs8 usb usb-to-spi bridge spi slave chip #1 spi slave chip #n external interrupt (gp6) interrupt interrupt ...
installation and operation ? 2012 microchip technology inc. ds52056a-page 15 when gp8 is configured for its dedicated functionality, the pin can be used as a bus release request for mcp2210 coming from another master. gp7 (configured for its dedicated functionality) is used as an spi bus release acknowledge signal towards the requesting master. when an external spi master requests the mcp2210 to release the bus, the device completes the current spi transfer (or it can be cancelled by the pc application sending the proper usb command), then releases the bus and signals the event on the acknowledge pin (gp7). the second master now has ownership of the bus, and can keep it, as long as the spi bus request pin (gp8) is kept asserted. by using the dedicated functionality of the gp7 and gp8, the mcp2210 can be used in a multiple spi master system. figure 2-3: mcp2210 typical usage diagram mcp2210 spi bus chip-select lines mosi, miso, sck usb usb-to-spi bridge spi slave chip #1 spi slave chip #n external interrupt (gp6) interrupt interrupt ... spi master #2 spi bus release request spi bus release acknowledge external interrupt gp8 gp7
mcp2210 breakout module user?s guide ds52056a-page 16 ? 2012 microchip technology inc.
mcp2210 breakout module user?s guide ? 2012 microchip technology inc. ds52056a-page 17 appendix a. schematic and layouts a.1 introduction this appendix contains the following schematics and layouts for the mcp2210 breakout module: ? board ? schematic ? board ? top silk and pads ? board ? top silk, pads and copper ? board ? top pads and copper ? board ? bottom silk and pads ? board ? bottom silk, pads and copper ? board ? bottom pads and copper
mcp2210 breakout module user?s guide ds52056a-page 18 ? 2012 microchip technology inc. a.2 board ? schematic 5v gnd d 0.1uf 0603 c5 0.1uf 0603 c4 gnd d gnd d gnd d 123 hdr m 1x3 vert j4 vdd 5v vusb 3.3v gp4 vdd gnd d miso sck mosi serial analyzer header hdr m 1x7 vert j1 gp0 gp1 gp2 gp3 gp4 mosi hdr m 1x7 vert j2 gp8 gp7 gp6 mi so vdd gnd d sck gp5 left side header right side header gnd d vout 3 vin 1 gnd 2 v ou t vi n g n d mcp1825s-3.3v u2 4.7uf 0603 c3 nt1 1234 56 hdr m 1x6 vert j3 22uf 1206 c1 usb_d- usb_d+ 12mhz 2 3 1 x1 5% 390 0603 r1 gnd d vdd vdd via_1.2x0.7 tp1 gnd d gnd d gnd d 5v usb_d- usb_d+ vusb gp0 gp1 gp2 gp3 mosi gp8 gp7 gp6 mi so sck rst osc2 osc1 vdd 1 osc1 2 osc2 3 rst 4 gp0 5 gp1 6 gp2 7 gp3 8 mosi 9 gp4 10 sck 11 gp5 12 mi so 13 gp6 14 gp7 15 gp8 16 vusb 17 d- 18 d+ 19 vss 20 v d d osc 1 osc 2 r s t g p 0 g p 1 g p 2 g p 3 m os i g p 4 sc k g p 5 m i s o gp 6 g p 7 gp 8 v us b d - d + v s s mcp2210 u1 gp5 gp4 0.1uf 0603 c2 gnd d 1uf 0603 c6 id 4 vbus 1 gnd 5 d- 2 d+ 3 i d vb u s gn d d - d + usb-b-mini smd j5 7 6 5 4 3 2 1 default connection between 1 - 2. user to cut the trace if 5v vdd is needed. 7 6 5 4 3 2 1 pickit?
schematic and layouts ? 2012 microchip technology inc. ds52056a-page 19 a.3 board ? top silk and pads
mcp2210 breakout module user?s guide ds52056a-page 20 ? 2012 microchip technology inc. a.4 board ? top silk, pads and copper
schematic and layouts ? 2012 microchip technology inc. ds52056a-page 21 a.5 board ? top pads and copper
mcp2210 breakout module user?s guide ds52056a-page 22 ? 2012 microchip technology inc. a.6 board ? bottom silk and pads
schematic and layouts ? 2012 microchip technology inc. ds52056a-page 23 a.7 board ? bottom silk, pads and copper
mcp2210 breakout module user?s guide ds52056a-page 24 ? 2012 microchip technology inc. a.8 board ? bottom pads and copper
mcp2210 breakout module user?s guide ? 2012 microchip technology inc. ds52056a-page 25 appendix b. bill of materials table b-1: bill of materials qty designator description_ manufacturer 1 part number 1 c1 cap. cerm. 22 uf 10v 20% y5v 1206 tdk ? corporation c3216y5v1a226z 3 c2, c4, c5 cap. cerm .1 uf 10% 16v x7r 0603 avx corporation 0603yc104kat2a 1 c3 cap. cerm. 4.7 uf 6.3v 10% x5r 0603 tdk corporation C1608X5R0J475K 1 c6 cap. cerm. 1 uf 16v 10% x7r 0603 tdk corporation c1608x7r1c105k 2j1, j2 do not populate conn. hdr. male .100 1x7 pos. vertical tyco ? electronics hdr m 1x7 vertical 1j3 do not populate conn. hdr. male .100 1x6 pos. vertical tyco electronics hdr m 1x6 vertical 1j4 do not populate conn. hdr. male .100 1x3 pos. vertical tyco electronics hdr m 1x3 vertical 1 j5 conn. rcpt. usb mini b r/a smd hirose electric co. ltd. ux60sc-mb-5st(80) 1 r1 res. 390 ohm 1/10w 5% 0603 smd panasonic ? - ecg erj-3geyj391v 1 u1 ic usb-to-spi ssop-20 microchip technology inc. mcp2210-i/ss 1 u2 ic ldo reg. 500 ma 3.3v sot-223-3 microchip technology inc. mcp1825s-3302e/db 1 x1 cer. resonator 12.0 mhz smd murata electronics ? cstce12m0g55-r0 note 1: the components listed in this bill of materials are representative of the pcb assembly. the released bom used in manufacturing uses all rohs-compliant components.
ds52056a-page 26 ? 2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-66-152-7160 fax: 81-66-152-9310 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/29/11

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